Case Study 1

Development of a Deep Etching Process for Capacitive Sensors without Halogens Description: the HaloFreeEtch project tackled the challenge of deep silicon etching for capacitive sensors without the use of halogens. The goal was to reduce environmental impact and improve process efficiency.

Challenges Addressed:

  • Elimination of halogenated gases from the etching process.

  • Maintaining the high aspect ratio required for the sensors.

  • Reducing overall energy consumption.

Solution Implemented:

  • Use of a hydrogen-based plasma etching process with metal catalysts.

  • Development of computational models to optimize the process.

  • Implementation of advanced in-situ diagnostic technologies to monitor volatile species in the plasma.

Results:

  • Improved process sustainability with a significant reduction in greenhouse gas emissions.

  • Achievement of high aspect ratios without compromising efficiency.

Case Study 2

Multi-Scale Modeling for Etching Process Optimization Description: another key outcome of the HaloFreeEtch project was the development of multi-scale models to predict and optimize energy efficiency and etching speed.

Challenges Addressed:

  • The need for accurate models that integrate fundamental chemical reaction data with operational parameters.

  • Experimental validation of the models under real-world conditions.

Solution Implemented:

  • Development of global models for plasma etching processes and techniques inspired by atomic layer etching.

  • Use of multi-objective optimization algorithms to enhance parameters such as gas temperature, flow rate, and input power.

Results:

  • Optimization of processes with a significant increase in energy efficiency.

  • Practical implementation of the models in industrial production settings.